1600 ℃ vacuum hot pressing furnace

Description：

Vacuum hot pressing furnace can combine vacuum / atmosphere, hot pressing and high-temperature sintering, and is suitable for high-temperature hot forming of new materials such as powder metallurgy and functional ceramics....

Product introduction:

1. The equipment has the functions of automatic pressurization, automatic pressure stabilization and pressure maintaining during pressure sintering. The imported pressure regulator has reliable performance and is equipped with a speed regulating valve to adjust the pressurization speed. It has the characteristics of digital signal output and strong anti-interference.

2. Thyristor voltage regulator + high current transformer is adopted, and Fuji digital display program instrument with p.i.d function is configured, with overtemperature alarm function. It forms interlocking protection manual / automatic control with the transformer. The action control adopts PLC programmable programmer, and the control panel is equipped with instruments and switches such as current, voltage, temperature, vacuum, water pressure, electrical interlocking and acoustic and optical alarm. The electrical components are made of Delixi brand, and the electric control panel is made according to Weitu standard, with convenient operation and high temperature control precision.

1600 ℃ vacuum hot pressing furnace

Apllication:
It is widely used in the field of powder metallurgy to prepare high-performance powder metallurgy parts, such as gears, cams, and cutters; in the field of functional ceramics, it can prepare functional ceramic materials such as transparent ceramics, piezoelectric ceramics, and thermistor ceramics; in the field of metal materials, it is used for hot pressing, diffusion bonding, powder forging and other processes of metal materials; in the field of semiconductor materials,it is used for the sintering, annealing, epitaxial growth and other processes of semiconductor materials to improve the performance and reliability of semiconductor devices.

Technical parameters:

Model	Effective heating area size (width * height * depth/mm）	Maximum temperature(℃)	Ultimate vacuum(pa)	Temperature uniformity(℃)	Pressure rise rate(Pa/h)	Press pressure（T）
KJ-V2000-16/16L	Φ160*160	2000	6.67*10-3	±5	≤0.67	＜20
KJ-V2000-20/20L	Φ200*200	2000	6.67*10-3	±5	≤0.67	＜25
KJ-V2000-25/30L	Φ250*300	2000	6.67*10-3	±5	≤0.67	＜30
KJ-V2000-35/40L	Φ350*400	2000	6.67*10-3	±5	≤0.67	＜35
KJ-V2000-45/50L	Φ450*500	2000	6.67*10-3	±5	≤0.67	＜40